Since 1971, Bullen, located in Eaton, Ohio, USA, has been technology leader in Ultrasonic machining using technologies like CNC and abrasive machining in state-of-the-art facilities.
Using ultrasonic machining Bullen grinds microscopic structures into the tooling and offers almost limitless assortment of types and shapes of cuts to its customers. Other manufacturing processes include lapping and polishing of glaswafers.
• CBC and Microabrasive Jet Machining
• Single & double side polished borosilicate wafers